Taiyo Holdings unveils next-generation semiconductor packaging material FPIM Series, achieving 700 nm CD three-layer RDL on a 12-inch wafer for the first time

At IEEE ESTC 2026, Taiyo Holdings unveiled FPIM Series, a next-generation negative-tone i-line photosensitive dielectric material for fine-pitch RDL using a dual-damascene process. In collaboration with imec, it achieved a three-layer RDL structure with a 700 nm CD on a 12-inch wafer. Both interconnects and vias met specifications, and the M1 layer showed good electrical properties, including leakage current and resistance.